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The WTC III Organizers are proud to announce the unveiling of the technical program. An impressive lineup of technical committee organizers have shaped a state-of-the art program that aims to boost the global awareness and significance of tribology.
Among the highlights--
Several sessions will focus on nanotribology and its role in the fast growing area of nano-technology; the influence of adhesion and stiction in MEMS devices; and a special K.L Johnson Symposium paying tribute to a pioneer in the field of contact mechanics. The program also covers many important areas that are vital to our industrial technologies such as lubricants, wear, tribochemistry, additives, bearings, engines, materials, surface engineering and aerospace. Advances in health and safety topics will be highlighted with an emphasis on the impact of tribology on biomaterials and biomedical devices. Several sessions have also been organized to address orthopaedic joints and how their well-being affects our daily lives. Click here to view the entire technical program.
Hotel Reservations
Need more reasons to stay at the Washington Hilton? Click here to see all the reasons why you should.
Featured Plenary Talks--
In addition to the technical sessions, the program features plenary talks by distinguished scientists and industry leaders including Pierre-Gilles de Gennes, Nobel Laureate in Physics, Prof. Van C. Mow, Biomedical Engineering, Columbia University, and Dr. James Spearot, Director, General Motors R&D and Wilfried J. Bartz, Professor, Technische Akademie Esslingen. Click here for more details.
Network with Who's Who
This international event will bring together tribology scientists, researchers and engineers from over 60 countries, as well as participants from over 35 cooperating associations. Network with who's who and be part of the knowledge exchange.
International Attendees
For additional information regarding visas and letters of invitation, please view the visa information.
Previous Issues of the WTC E-Newsletter
Issue No. 1
Issue No. 2
Issue No. 3
Issue No. 4
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